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Crack growth measurement and J-integral evaluation of additively manufactured polymer using digital image correlation and FE modeling
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  • Mohamed Ali BOUAZIZ,
  • MARAE-DJOUDA Joseph,
  • ZOUAOUI Marouene,
  • GARDAN Julien,
  • HILD François
Mohamed Ali BOUAZIZ
EPF School of Engineers
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MARAE-DJOUDA Joseph
EPF School of Engineers
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ZOUAOUI Marouene
EPF School of Engineers
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GARDAN Julien
EPF School of Engineers
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HILD François
ENS Paris-Saclay
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Abstract

This paper presents and compares two combined experimental-numerical techniques for the investigation of fracture properties of additively manufactured polymer parts using digital image correlation (DIC) measurements. The first method uses only measured kinematic fields, and the second is based on Finite Element simulations driven by measured boundary conditions. A micro Single Edge Notched Tensile sample manufactured by fused filament fabrication of ABS is studied. It is shown that both methods locally extract J-integrals, and the crack tip is accurately located by the FE-based method. By comparing computed displacements to those measured via DIC it is possible to locally check the validity of the numerical model. The initiation and propagation stages are analyzed independently thanks to two different magnifications of acquired image series

Peer review status:ACCEPTED

29 Oct 2020Submitted to Fatigue & Fracture of Engineering Materials & Structures
31 Oct 2020Submission Checks Completed
31 Oct 2020Assigned to Editor
07 Nov 2020Reviewer(s) Assigned
12 Dec 2020Review(s) Completed, Editorial Evaluation Pending
16 Dec 2020Editorial Decision: Revise Major
27 Dec 20201st Revision Received
29 Dec 2020Assigned to Editor
29 Dec 2020Submission Checks Completed
30 Dec 2020Reviewer(s) Assigned
11 Jan 2021Review(s) Completed, Editorial Evaluation Pending
18 Jan 2021Editorial Decision: Revise Minor
19 Jan 20212nd Revision Received
20 Jan 2021Assigned to Editor
20 Jan 2021Submission Checks Completed
21 Jan 2021Review(s) Completed, Editorial Evaluation Pending
22 Jan 2021Editorial Decision: Accept