The arrangement of heat sources in the COB module is a major factor that determines the rise in junction temperature due to heat spreading. To find junction temperature and observe thermal dissipation, the LED package was first observed under an infrared thermography camera. A Keithley 2602A System Sourcemeter was used to source current across the Anode and the Cathode of the module by setting a voltage difference. 0.7A current was sourced, and the source meter gave a voltage reading of 9.59V. The test current data was obtained from the LED datasheet. This reading is consistent with the datasheet reading 9.4V. A temperature controller maintained the base temperature of the COB module (aluminum substrate) at 25°C. The next set of experiments were performed using an Aluminum 6061 alloy cylindrical heat sink at 2 input currents, 0.7 amperes, and 0.5 amperes. The base of the beat sink was insulated by introducing a thin layer of vacuum. The temperatures were then plotted to give the transient temperature increase for the different probed points on the LED as shown in \ref{936585} and were compared to the finite element analysis simulations on ANSYS. The model is shown in \ref{678296}. For simplicity, except the base of the LED substrate, rest all sides were insulated and adiabatic conditions were assumed. This assumption is consistent with the fact that because of the heat sink, most of the heat is dissipated from the backside of the LED. The heat loss due to convection from sides and the top surface is negligible. To simulate a heat sink, these conditions were implemented.