Error! Reference source not found. shows the transient heating response of different points on the CITIZEN LED. The location of the probes can be found in \ref{833400}. The curve for probe 1 (blue curve) lies above the curve for probe 4 (purple curve) as seen in \ref{450313}. This shows that the heat sources at the center heat up more than the heat sources at the periphery with a steady state temperature difference of about 1.5°C. The heat spreading effect causes an overlap in the thermal profile and causes an intensified thermal crossover effect at the center. The maximum temperature rise in the infrared experiments was compared to the maximum temperature rise in the FEM results. We notice that the maximum temperature is located at the center of the LED chip and the influence zone is surrounding the LED chip on the substrate as seen in Error! Reference source not found. The maximum temperature is approximately 41°C which matches well with the maximum temperature of the LED FEM simulation model as seen in \ref{651335}. As seen from the figure, the temperature rise rate during simulations is very high initially when compared to the temperature rise rate in infrared experiments. A temperature controller forces the base temperature at 25°C. When current is passed across the electrodes, the temperature of the LED and hence the base rises initially, and the base temperature is forced down to 25°C. However, this cooling is not instantaneous and the delay is responsible for the difference in heating curves. In ANSYS simulations, the temperature at the base is at 25°C throughout and there is no time delay. To better model the experimental conditions, a cylindrical heat sink with natural still air convection condition was used for experiments. It can be inferred from \ref{658868} that the experimental heating rate is very close to the heating rate observed during simulations and thus a better comparison can be established as compared to the previous set of experiments. From the CITIZEN LED first set of experiments, the problem statement is drawn. The heat sources at the center heat up more than the heat sources at the periphery due to high thermal crossover effect at the center. A proposed solution is to spread the heat sources along the periphery and not having any heat sources at the center. The center of the LED module can be used to attach it to the PCB substrate. A single bonding point at the center would increase the area available for the heat sources to be distributed around the center high thermal crossover effect region.