The minimum distance results gave an optimum distance of 4mm for arranging the heat sources. Junction temperature is the highest operating temperature of the semiconductor. Most LEDs are thermally modeled to limit the junction temperatures to 85°C, exceeding which results in their gradual degradation and failure. To design compact high power LED arrays, the arrangement of heat sources must be optimized to limit the junction temperatures to 85°C while maintaining the compactness of the module. Multiple simulations were thus performed to determine the maximum number of heat sources that can be packed at a center distance of 2mm for thermal resistance of the heat sink ranging for 0.1K/W to 30K/W. The experiments were first done with 3 heat sources spaced equally along the circumference of a circle of radius 4mm. Temperature probe data for thermal resistances varying from for 0.1K/W to 30K/W and heat flow per heat source varying from 0.25W to 4W was gathered. After 3 heat sources, the number of heat sources was increased by 1 and the experiment was repeated. Data for up to 8 heat sources was collected since packing more than 8, caused the heat sources to be extremely close to each other resulting in high adjacent crossover effect. This resulted in hotspots along the circumference of the arrangement of heat sources which were undesirable. At 8 heat sources, in a circular arrangement, the distance between the center of adjacent heat sources is 3.142mm (<4mm) and hence the thermal crossover effect is very high. The circular arrangement is compared to a linear arrangement such that both occupy the same area on the substrate. As seen from \ref{254357} and \ref{449469}, there is no heat source at the center. During the infrared camera experiments, the temperature of the heat source at the center is more than the temperature of the heat source at periphery owing to thermal crossover effect due to lateral heat flow from the surrounding heat sources. The CITIZEN LED studied in \ref{827670} had GaN LED films encapsulated in a layer of silicone. In the case of encapsulation, some heat travels sideways through the silicone covering and poor thermal conductivity of silicone causes heat accumulation around the heat source. The experiments were repeated using a silicone covering, whose dimensions were obtained using an optical microscope.