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\begin{document}

\title{Analytical electro-thermal model and 3-D thermal resistance network for
SMD-based printed circuit board power converters}



\author[1,2]{Talis Piovesan}%
\author[1,3]{Edemar O. Prado}%
\author[3]{Hamiltom C. Sartori}%
\author[1,3]{José R. Pinheiro}%
\affil[1]{Federal University of Bahia}%
\affil[2]{Federal Institute Farroupilha}%
\affil[3]{Federal University of Santa Maria}%


\vspace{-1em}



  
  \date{May 17, 2024}


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\selectlanguage{english}
\begin{abstract}
This work presents an analytical electro-thermal model for SMD-based
printed circuit board (PCB) power converters. Temperature-dependent
component losses are derived from analytical models and a 3-D thermal
resistance network is employed to characterize the temperatures across
components and PCB paths. Furthermore, the work explores the mechanical
and thermal interaction within the PCB paths, concurrently analyzing
semiconductor switches and the power inductor in synchronous commutation
cell configurations. The proposed model undergoes evaluation with two
different PCB layouts of a synchronous boost converter, operating at 350
kHz with 50 W and 75 W. Model-generated temperatures are compared with
experimental measurements using a thermal imaging camera and with Finite
Elements Analysis (FEA) in Ansys Icepak. The acquired results validate
the accuracy of the proposed model.

\par\null%
\end{abstract}%



\sloppy


\hyperref[csl:1]{(Wang et al., 2017}; \hyperref[csl:2]{Jin et al., 2019}; \hyperref[csl:3]{Zhang et al., 2019}; \hyperref[csl:4]{Liu \& Hsu, 2018}; \hyperref[csl:5]{Lidow et al., 2019}; \hyperref[csl:6]{Hariya et al., 2017}; \hyperref[csl:7]{Prado et al., 2022}; \hyperref[csl:8]{Letellier et al., 2019}; \hyperref[csl:9]{Qian, 2003}; \hyperref[csl:10]{Gurpinar et al., 2018}; \hyperref[csl:11]{Wu et al., 2014}; \hyperref[csl:12]{Remsburg, 1998}; \hyperref[csl:13]{Prado et al., 2023}; \hyperref[csl:14]{Gautam et al., 2013}; \hyperref[csl:15]{Baker et al., 2021}; \hyperref[csl:16]{Ji et al., 2013}; \hyperref[csl:17]{Reusch \& Strydom, 2014}; \hyperref[csl:18]{Huang et al., 2013}; \hyperref[csl:19]{Chen et al., 2013}; \hyperref[csl:20]{Yang et al., 2014}; \hyperref[csl:21]{Melito et al., 2015}; \hyperref[csl:22]{Shen et al., 2019}; \hyperref[csl:23]{Dede et al., 2015}; \hyperref[csl:24]{Dede et al., 2018}; \hyperref[csl:25]{Jones \& de Rooij, 2018}; \hyperref[csl:26]{Zhang, 2021}; \hyperref[csl:27]{Reichl et al., 2015}; \hyperref[csl:28]{Shahjalal et al., 2020}; \hyperref[csl:29]{Delaram et al., 2018}; \hyperref[csl:30]{Chen et al., 2020}; \hyperref[csl:31]{Staliulionis et al., 2014}; \hyperref[csl:32]{Cengel \& Ghajar, 2012}; \hyperref[csl:33]{Bergman et al., 2018}; \hyperref[csl:34]{Yue et al., 2018}; \hyperref[csl:35]{Bolsi et al., 2022}; \hyperref[csl:36]{Prado et al., 2022}; \hyperref[csl:37]{Graovac et al., 2006}; \hyperref[csl:38]{Lee, 1995}; \hyperref[csl:39]{\textit{{Heat Sink Selection Guide for Thermally Enhaced SO8-FL}}, 2015)}

\selectlanguage{english}
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